CLIP Package:

The software is developed by CMP Technology with the help of Mr. Larry Cammilletti from Conexant Systems Inc.  Larry had provided invaluable inputs during the development of the package. The simulation and dummy fill results had been validated on product lines in production Fab. Reduction of density variation of 50% over conventional dummy have been achieved. Yield enhancement of 6% in real production for a mature and stable yielding product has also been obtained.

The package contains 4 related programs: pattern density calculator, CMP simulator, process characterizer and smart dummy filler. An overview of the system is on the system flow page.

Smart dummy filler (tiling and slotting )

The dummy filler automatically and dynamically selects dummy  densities according to the local effective pattern density variation. These dummies are placed in compliance with  the design rules specified by the user by construction.  The smart-dummy algorithm employed in the dummy filler minimizes the parasitic capacitance introduced by dummies and maximize pattern density uniformity. For copper CMP, this leads to minimized dishing and erosion.

CMP simulator

The CMP simulator calculates the post-CMP film thickness profile across a die from its GDS file, the deposition thickness, and the CMP process conditions using CMPTech’s proprietary algorithm.

Film pattern density calculator

The pattern density calculator gives pattern density mapping of a die from its GDS layout file and the step coverage of the conformal deposited film.   It is also capable of calculating the effective pattern density for HDP film. Computation of accurate film pattern density assures realistic dummy fill instead of simple layout density control.

Process characterizer

The characterizer automatically calculate the parameters used in the proprietary CMP model of CLIP software. These includes planarization length or/and pad deformation tangent.