Dummy Filler

The dummy filler automatically and optimally places dummies ( tiling and slotting ) according to the design rules specified the user and the CMP simulation results. The smart-dummy algorithm employed in the filler minimizes the parasitic capacitance introduced by dummies and maximize pattern density uniformity. The following chart compares pattern density uniformity among smart dummy, conventional dummy and without dummy. One can see easily that conventional dummy have 50% more density variation than smart dummy, and without dummy there would be 100% more density variation than smart dummy. These density variation translates directly into post-CMP film thickness variation or dishing and erosion in copper CMP. The smart dummy avoids the significant error produced by simple layout density control since realistic film pattern density is used.

In the chart, the X axis is pattern density of a location on the die. The Y axis is percentage of spots on the die that have pattern densities within certain range.

Key Benefits

	Optimal dummy filling results in best possible planarity, which leads to yield enhancement.
	Eliminates guess work, saves reticle cost, equipment time and engineer time.
	Speeds up process development by getting it right at the first try.
	Can also be used for accurate layout density control for manufacturability.

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