CMP Technology - Simulation, pattern density calculation and dummy filling for better planarization and yield for aluminum, copper, ILD and STI CMP process using HDP or CVD film. Joint optimization with OPC, PSM and interconnect parasitic extraction.

CMP Technology

What does a 12% yield enhancement mean to you?

CMP Technology proudly present the semiconductor industry's first and the only commercial Chemical Mechanical Planarization (CMP) software package, CLIP, for CMP simulation, density calculation and smart dummy filling ( tiling and slotting ) to improve pattern density uniformity. The software is applicable to STI, ILD, Copper damascene, HDP, conformal CVD process and 300 mm wafer. Our proprietary technology has been time tested in real Fab. Film thickness variation improvement of 50% and yield improvement of 6% over customer in-house simple dummy-fill has been achieved in real production.

Wouldn't it be nice to know pattern density at design stage?

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