CMP Technology proudly present the semiconductor industry's
first and the only commercial Chemical Mechanical Planarization (CMP) software package, CLIP, for CMP simulation, density
calculation and smart dummy filling ( tiling and slotting ) to improve pattern density uniformity. The software is applicable to
STI, ILD, Copper damascene, HDP, conformal CVD process and 300 mm wafer. Our proprietary technology has been
time tested in real Fab. Film thickness variation improvement of 50% and yield
improvement of 6% over customer in-house simple dummy-fill has
been achieved in real production.